Dari desain PCB hingga produksi massal, Fanway memberikan layanan manufaktur PCB cepat giliran sebagai solusi satu atap untuk memenuhi beragam persyaratan proyek Anda dan mempercepat waktu-ke-pasar Anda.
FPC PCB is a special type of PCB manufactured using bendable substrate materials, characterized by three core features that flexibility, ultra-thin structure and 3D routing. Fanway specialize in designing and manufacturing high-quality FPC PCBs that bend, twist, and adapt to customer’s various applications delivering perfect reliability in compact, limited space environments. We are committed be your trusted supplier and partner in FPC PCB manufacturing.
We have professional DFM (Design For Manufacturing) analyse to help you optimize the design. We support 3D modeling and simulation of complex rigid and flexible boards.
Our high precision laser drilling and microhole technology ensures high density interconnections, and precisely control the laminating process of rigid and flexible combination parts to ensure product consistency.
We have 100% electrical testing and AOI (Automatic Optical Inspection) to ensure product reliability. The PCB product process strictly follow IPC standards.
Our rapid prototype service to help you shorten product development cycle. Our low-volume to high-volume production to meet different customer needs.
✅ Ultra-Thin & Lightweight
It is the best solution for portable devices, wearables, and IoT products.
✅ Flexibility & Durability
Designed to withstand repeated bending, folding, and vibrations that performance not be effected.
✅ Space-Saving Designs
FPC PCBs solution replace rigid boards and complex wiring that reduce assembly complexity and weight.
✅ High-Density Interconnects
With with fine-pitch traces, micro-vias, and multilayer configurations to achieve advanced signal integrity.
✅ Thermal & Chemical Resistance
Working in extreme temperatures, moisture, and corrosive conditions, ensuring lifetime in automotive, medical, and industrial settings.
| Layer Composition | Material | Typical Thickness | Key Function |
| Base Material | Polyimide (PI) | 12.5-50μm | Insulation & Support |
| Conductive Layer | Rolled Annealed Copper (RA) | 9-35μm | Signal Transmission |
| Coverlay | PI/PET | 12.5-25μm | Circuit Protection |
| Adhesive Layer | Acrylic/Epoxy | 15-25μm | Interlayer Bonding |
Consumer Electronics: Smartphones, tablets, foldable displays, and wearables.
Automotive: Dashboard controls, LED lighting, sensors, and EV battery systems.
Medical Devices: Wearable monitors, endoscopes, implantable devices, and diagnostic tools.
Aerospace & Defense: Avionics, UAVs, and compact communication systems.
Industrial IoT: Robotics, sensors, and automation equipment.
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Alamat
Bangunan 3, Zona Industri Pertama Mingjinhai, Jalan Shiyan, Distrik Bao'an, Shenzhen, Guangdong, Cina, Kode Zip: 518108
Telp
Surel
